Compact 2-axis driving system for lifting and rotating
Bewegungsbereich 20 mm, +/- 190°

The lift and rotating unit LPKF Z-φ 2/190 was developed especially for extremely fast and precise positioning of wafers in equipments for the chip industry. Due to the small and compact construction it is also capable for assembly in LPKF cross tables. In combination with the 3D correction algorithm, developed by LPKF, Z-failures of the complete system are compensable. Vacuum chucks can be optional offered by LPKF.

The LPKF Z-φ 2/190 lifting rotary unit can be used for smaller turning ranges (+/-10°).

z-φ Modul
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