HighSpeed 3D measuring system with handling and fault sorting

The 3D Flip Chip Bump Inspection System LPKF FCBIS 3x is a precise 3D measuring machine for the HighSpeed inspection of parts with microstructures, such as bumps on BGA-interposers. The surface is scanned with a confocal line sensor.

Structural design

• Input lift for Jedec trays
• Tray singulation and transport unit
• Matrix handler for interposer
• Measuring machine consisting of:
          - Granite based XY-Cross Table
          - Linear motors with air bearings
          - HighSpeed 3D line sensors
• Sorting unit for error parts
• Output lift for Jedec trays

Technical data

Measuring range XY:	max. 600x600 mm
Measuring range Z:	400 µm
Resolution Z:	0,5 µm
Measuring accuracy:	+/- 2 µm

FCBIS
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